Common hot-melt adhesives in low-pressure injection moulding are based on polyamide.
The polyamides are very special sealing compounds. These combine material properties with adhesive properties.
This means good adhesion to the cable materials, as well as to the usual solder resists on the circuit board. The material properties of the polyamides used meet the requirements in the terms of elasticity and the operating temperature range.
To protect electronic components during the manufacture of plugs or caps, the hot glue can be pressed into a tool / cavity using the low-pressure process with only approx. 2 – 50 bar.
With this process, components are over-moulded with hot-melt adhesive to give shape, and the wire or contact is sealed, insulated and mechanically protected.
The simple and safe handling of the low-pressure “potting” machines through the regulated injection and cooling times (immediately ready for use) ensures a high level of reproducibility and productivity in the production area.
The main application here can be seen in the automotive sector, due to the high productivity / number of pieces.