Reactive adhesives

The reactive hot-melt adhesives on the basis of polyurethane and polyolefin are becoming increasingly important. 

They enable constructive bonds to be achieved.

The principle behind these moisture-curing hot-melt adhesives is a two-stage setting mechanism. After the reactive PUR hot melt has been applied, it first sets physically, giving the bond a handling strength.  

In the second step, the adhesive reacts chemically with the available humidity to form high molecular weight polymers with high cohesion. The speed of the reaction depends on the available humidity.

In this way, exceptionally high temperature resistance can be achieved, with good flexibility at low temperatures and resistance to a large number of chemicals. Standard PUR hot melts with an MDI content > 0.1 % are subject to labelling.

Another group in the field of reactive hot-melt adhesives are the formulations based on silane-modified polyolefins. These are distinguished from PUR hot melts in particular by the fact that a bonding of non-pretreated polypropylene is possible. In addition, they do not contain any isocyanates and are therefore not subject to labelling. The cohesive properties, on the other hand, are below those of polyurethane-based adhesives.

Your advantages when using reactive PUR / POR products:

High cohesion enables constructive bonds

High temperature resistance in the cold as well as in the heat enable, for example, use in the automotive industry 

Resistance to plasticizers, oils and solvents enables the bonding of soft PVC and demanding filter applications

High level of ageing stability of the bond

PUR have a very wide adhesion spectrum to many plastics, for instance ABS

POR offer a very good adhesion spectrum to low-energy surfaces, for example PP

Our product range

Further adhesives on request.

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Structural bonds with high demands on strength and reaction to changes in temperature

  • Moisture curing
  • Long open time
  • Good solvent resistance
  • High cohesion


Structural bonds with high demands on strength and reaction to changes in temperature

  • Fast handling strength
  • Average open time
  • Moisture curing
  • Good solvent resistance


For bonding low-energy surfaces with high demands on the cohesive behaviour.

  • Solvent-free
  • High heat resistance
  • • Good flexibility at low temperatures


Particularly suitable for surface lamination and light assembly bonds. Due to the reduced MDI content < 1%, the H351 labelling is no longer required.

  • Low MDI < 1 %
  • Good sprayability
  • FDA guidelines 175.105
  • Very long open time


Particularly suitable for surface lamination and light assembly bonds.

  • Excellent solvent resistance
  • Very soft glue line
  • Long open time
  • Good sprayability


For assembly and constructional bonds that are exposed to high temperatures. Available in black and white.

  • Low processing viscosity
  • Moisture curing
  • UV marked
  • Fast cohesion build up
  • Good solvent resistance


for commercial requests

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